Mainly processing of buffing pads for semiconductors and glass substrates and manufacture and sale of buffing pad processing devices. This company has developed some innovative new methods; it holds 17 patents registered in/outside Japan. This year, the company succeeded in commercialization of an "eco-technology" oriented product that fits with the times; it started selling it.
We established a joint venture, ARACA, Inc, in USA in 2004. We also have exported to South Korea and Taiwan. To protect our proprietary techniques from unauthorized use, we hold six patents registered in USA and two patents registered in China. We applied for some patents in Taiwan and Korea. Therefore, customers can use our cutting-edge technology without worrying about unauthorized use.
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